A study on the influence of void and moisture contents of some building materials on their thermal transport properties and implications on thermal performance of building envelops
dc.contributor.advisor | Krishnamoorthy, S | |
dc.contributor.author | Bhattacharjee, B. | |
dc.date.accessioned | 2013-11-21 | |
dc.date.accessioned | 2024-10-29T10:59:25Z | |
dc.date.issued | 1989 | |
dc.identifier.uri | http://10.17.50.146:4000/handle/123456789/2659 | |
dc.relation.ispartofseries | TH1724 | |
dc.subject | Thermal performance of building | |
dc.title | A study on the influence of void and moisture contents of some building materials on their thermal transport properties and implications on thermal performance of building envelops | |
dc.type | Thesis |
Files
Original bundle
1 - 1 of 1
No Thumbnail Available
- Name:
- TH-1724_ABSTRACT.pdf
- Size:
- 522.25 KB
- Format:
- Adobe Portable Document Format