Wafer-level vacuum packaging for MEMS technology

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dc.contributor.advisorMitra, Bhaskar
dc.contributor.authorMaharshi, Vikram
dc.date.accessioned2024-01-12
dc.date.accessioned2024-10-29T11:19:19Z
dc.date.issued2023
dc.identifier.urihttp://10.17.50.146:4000/handle/123456789/3637
dc.relation.ispartofseriesTH7483
dc.subjectMetal thermocompression
dc.titleWafer-level vacuum packaging for MEMS technology
dc.typeThesis

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