Surface modification assisted diffusion bonding of pure copper, AA6082 and wire ARC additively manufactured components

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dc.contributor.authorDipin Kumar R.
dc.date.accessioned2025-11-17T09:00:07Z
dc.date.issued2025-04-23
dc.identifier.urihttps://ir.iitd.ac.in/handle/123456789/7711
dc.language.isoen
dc.publisherIIT Delhi
dc.subjectDiffusion bonding
dc.subjectSolid state diffusion
dc.subjectTenacious oxide layer
dc.subjectLow-cost friction stir process
dc.subjectWire manufactured
dc.titleSurface modification assisted diffusion bonding of pure copper, AA6082 and wire ARC additively manufactured components
dc.typeThesis

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