Surface modification assisted diffusion bonding of pure copper, AA6082 and wire ARC additively manufactured components

Dipin Kumar R.2025-11-172025-04-23https://ir.iitd.ac.in/handle/123456789/7711enDiffusion bondingSolid state diffusionTenacious oxide layerLow-cost friction stir processWire manufacturedSurface modification assisted diffusion bonding of pure copper, AA6082 and wire ARC additively manufactured componentsThesis